How Big is the Semiconductor Packaging Equipment Market | Trends, Forecast & Opportunities 2025

Code: MTA8883 Publication Date: Sep 2025

How Big is the Semiconductor Packaging Equipment Market?

According to 6Wresearch internal database and industry insights, the Semiconductor Packaging Equipment Market was estimated at USD 8.9 billion in 2024 and is projected to reach USD 15.7 billion by 2031, expanding at a CAGR of 8.5% during the forecast period 2025-2031.

The expansion of the market is driven by rising demand for advanced consumer electronics, increasing adoption of IoT and AI devices, expansion in automotive electronics, miniaturization of semiconductor components, and rising investments in 5G and data centers.

Key Growth Drivers of the Semiconductor Packaging Equipment Market

  • Rising adoption of advanced packaging technologies such as 3D and wafer-level packaging
  • Growing demand for high-performance and compact consumer electronics
  • Increasing investments in 5G infrastructure and semiconductor manufacturing
  • Expansion in automotive and industrial electronics applications
  • Advancements in IoT, AI, and edge computing driving chip demand

Semiconductor Packaging Equipment Market Trends

Semiconductor Packaging Equipment Market is witnessing major growth with notable trends such as rising use of advanced packaging solutions including fan-out and chiplet technologies. The use of AI-driven process control and automation in semiconductor packaging is growing quickly. With higher-density packaging options, the industry is heading toward miniaturization. Innovation is also being fueled by the growing need for sustainable packaging techniques and energy-efficient equipment. The market outlook is being further enhanced by the growing demand for semiconductors in smart devices and electric vehicles.

Emerging Developments in the Semiconductor Packaging Equipment Market

Semiconductor Packaging Equipment Market is set to grow with ongoing advancements in heterogeneous integration and system-in-package technologies. Market is observing rising R&D investments in high-density interconnects and advanced substrate materials Technology adoption is accelerating due to strategic partnerships between semiconductor foundries and equipment manufacturers. Furthermore, a major factor driving up equipment demand is the growth of semiconductor factories in North America and Asia-Pacific. The market expansion is also being shaped by the creation of next-generation packaging solutions that support AI, 5G, and high-performance computing.

List of Leading Companies in the Semiconductor Packaging Equipment Market

Some of the leading companies include:

  • Applied Materials Inc.
  • Tokyo Electron Limited
  • ASM Pacific Technology
  • Kulicke & Soffa Industries Inc.
  • Disco Corporation
  • SUSS MicroTec SE
  • Shibaura Mechatronics Corp.
  • Lam Research Corporation
  • BESI (BE Semiconductor Industries N.V.)
  • Hanmi Semiconductor Co., Ltd.

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